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An Introduction to Heat Pipes - (Thermal Management of Microelectronic and Electronic System) by G P Peterson (Hardcover)

An Introduction to Heat Pipes - (Thermal Management of Microelectronic and Electronic System) by  G P Peterson (Hardcover) - 1 of 1
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About this item

Highlights

  • Your complete resource on heat pipe operation, behavior, performance characteristics, and limitations This book is designed to help students, operations engineers, andmechanical and electrical engineers in the electronic packagingindustry grasp the principles of operation for a wide range of heatpipes.
  • About the Author: G. P. PETERSON is the Tenneco Professor and Head of the Departmentof Mechanical Engineering at Texas A&M University, where hereceived his PhD in Mechanical Engineering.
  • 368 Pages
  • Technology, Mechanical
  • Series Name: Thermal Management of Microelectronic and Electronic System

Description



Book Synopsis



Your complete resource on heat pipe operation, behavior, performance characteristics, and limitations

This book is designed to help students, operations engineers, andmechanical and electrical engineers in the electronic packagingindustry grasp the principles of operation for a wide range of heatpipes. Packed with examples and design information, it takes youthrough the background and historical development of heat pipes, discusses the interfacial phenomena that govern their operationalcharacteristics, and presents the fundamental operating principlesand limitations of both heat pipes and thermosyphons.

Along with detailed presentations of the governing physicalphenomena involved, this comprehensive guide features extensivecoverage of:
* The background physics of fluids, their behavior in heat pipes, and associated interfacial phenomena
* Heat pipe design methodologies and manufacturing considerations
* Applications for cooling both electrical and mechanical systems
* The full range of heat pipe classifications, including rotatingand revolving, micro, cryogenic, and variable conductance heatpipes, as well as thermal diodes and switches

This book provides all the information and guidance you need toincrease your understanding of these innovative devices and tobegin to apply them to the thermal control of electronic devicesand components.



From the Back Cover



Your complete resource on heat pipe operation, behavior, performance characteristics, and limitations

This book is designed to help students, operations engineers, and mechanical and electrical engineers in the electronic packaging industry grasp the principles of operation for a wide range of heat pipes. Packed with examples and design information, it takes you through the background and historical development of heat pipes, discusses the interfacial phenomena that govern their operational characteristics, and presents the fundamental operating principles and limitations of both heat pipes and thermosyphons.

Along with detailed presentations of the governing physical phenomena involved, this comprehensive guide features extensive coverage of:

  • The background physics of fluids, their behavior in heat pipes, and associated interfacial phenomena
  • Heat pipe design methodologies and manufacturing considerations
  • Applications for cooling both electrical and mechanical systems
  • The full range of heat pipe classifications, including rotating and revolving, micro, cryogenic, and variable conductance heat pipes, as well as thermal diodes and switches

This book provides all the information and guidance you need to increase your understanding of these innovative devices and to begin to apply them to the thermal control of electronic devices and components.



About the Author



G. P. PETERSON is the Tenneco Professor and Head of the Departmentof Mechanical Engineering at Texas A&M University, where hereceived his PhD in Mechanical Engineering. He has been ProgramDirector of the National Science Foundation's Thermal Transport andThermal Processing Program and a research scientist at NASA'sJohnson Space Center.
Dimensions (Overall): 9.57 Inches (H) x 6.44 Inches (W) x .9 Inches (D)
Weight: 1.53 Pounds
Suggested Age: 22 Years and Up
Number of Pages: 368
Series Title: Thermal Management of Microelectronic and Electronic System
Genre: Technology
Sub-Genre: Mechanical
Publisher: Wiley-Interscience
Format: Hardcover
Author: G P Peterson
Language: English
Street Date: September 28, 1994
TCIN: 92763907
UPC: 9780471305125
Item Number (DPCI): 247-04-2340
Origin: Made in the USA or Imported
If the item details above aren’t accurate or complete, we want to know about it.

Shipping details

Estimated ship dimensions: 0.9 inches length x 6.44 inches width x 9.57 inches height
Estimated ship weight: 1.53 pounds
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