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Metal-Dielectric Interfaces in Gigascale Electronics - (Springer Materials Science) by Ming He & Toh-Ming Lu (Hardcover)

Metal-Dielectric Interfaces in Gigascale Electronics - (Springer Materials Science) by  Ming He & Toh-Ming Lu (Hardcover) - 1 of 1
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About this item

Highlights

  • Metal-dielectric interfaces are ubiquitous in modern electronics.
  • Author(s): Ming He & Toh-Ming Lu
  • 149 Pages
  • Technology, Electronics
  • Series Name: Springer Materials Science

Description



About the Book



This book presents a unified approach to understanding the diverse phenomena observed at metal-dielectric interfaces. It offers a clear account of the relationship between interface science and its applications in interconnect structures.



Book Synopsis



Metal-dielectric interfaces are ubiquitous in modern electronics. As advanced gigascale electronic devices continue to shrink, the stability of these interfaces is becoming an increasingly important issue that has a profound impact on the operational reliability of these devices. In this book, the authors present the basic science underlying the thermal and electrical stability of metal-dielectric interfaces and its relationship to the operation of advanced interconnect systems in gigascale electronics. Interface phenomena, including chemical reactions between metals and dielectrics, metallic-atom diffusion, and ion drift, are discussed based on fundamental physical and chemical principles. Schematic diagrams are provided throughout the book to illustrate interface phenomena and the principles that govern them.

Metal-Dielectric Interfaces in Gigascale Electronics provides a unifying approach to the diverse and sometimes contradictory test results that are reported in the literature on metal-dielectric interfaces. The goal is to provide readers with a clear account of the relationship between interface science and its applications in interconnect structures. The material presented here will also be of interest to those engaged in field-effect transistor and memristor device research, as well as university researchers and industrial scientists working in the areas of electronic materials processing, semiconductor manufacturing, memory chips, and IC design.



From the Back Cover



Metal-dielectric interfaces are ubiquitous in modern electronics. As advanced gigascale electronic devices continue to shrink, the stability of these interfaces is becoming an increasingly important issue that has a profound impact on the operational reliability of these devices. In this book, the authors present the basic science underlying the thermal and electrical stability of metal-dielectric interfaces and its relationship to the operation of advanced interconnect systems in gigascale electronics. Interface phenomena, including chemical reactions between metals and dielectrics, metallic-atom diffusion, and ion drift, are discussed based on fundamental physical and chemical principles. Schematic diagrams are provided throughout the book to illustrate interface phenomena and the principles that govern them.

Metal-Dielectric Interfaces in Gigascale Electronics provides a unifying approach to the diverse and sometimes contradictory test results that are reported in the literature on metal-dielectric interfaces. The goal is to provide readers with a clear account of the relationship between interface science and its applications in interconnect structures. The material presented here will also be of interest to those engaged in field-effect transistor and memristor device research, as well as university researchers and industrial scientists working in the areas of electronic materials processing, semiconductor manufacturing, memory chips, and IC design. Presents a unified approach to understanding the diverse phenomena observed at metal-dielectric interfaces

Features fundamental considerations in the physics and chemistry of metal-dielectric interactions

Explores mechanisms of metal atom diffusion and metal ion drift in dielectrics

Provides keys to understanding reliability in gigascale electronics

Focuses on a dynamic area of current research that is a foundation of futureinterconnect systems, memristors, and solid-state electrolyte devices

Presents a unified approach to understanding the diverse phenomena observed at metal-dielectric interfaces
Dimensions (Overall): 9.2 Inches (H) x 6.1 Inches (W) x .6 Inches (D)
Weight: .8 Pounds
Suggested Age: 22 Years and Up
Number of Pages: 149
Series Title: Springer Materials Science
Genre: Technology
Sub-Genre: Electronics
Publisher: Springer
Theme: General
Format: Hardcover
Author: Ming He & Toh-Ming Lu
Language: English
Street Date: December 1, 2011
TCIN: 92765897
UPC: 9781461418115
Item Number (DPCI): 247-16-7164
Origin: Made in the USA or Imported
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Shipping details

Estimated ship dimensions: 0.6 inches length x 6.1 inches width x 9.2 inches height
Estimated ship weight: 0.8 pounds
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